THIM3: A New Perspective on Component Insertion
September 18, 2026
The growing complexity of electronic manufacturing lines has also increased the demands placed on through-hole processes. Today, the insertion of components, terminals, and pins requires not only speed, but also precision, control, and adaptability to different product configurations.
In this scenario, automation can transform a traditionally demanding stage into a more stable and measurable process. The THIM3 family integrates insertion solutions designed to meet different electronic assembly needs, from radial and axial components to terminals, pins, and odd-form components.
Greater Precision for Through-Hole Insertion
One of the main attributes of THIM3 solutions is the integration of vision systems, servo motors, and process monitoring, enabling the control of critical variables during insertion.
In pin insertion applications, for example, the equipment can operate with an XY positioning system using a servo motor and ball screw, providing positioning accuracy of up to 0.01 mm. The system also incorporates insertion-depth detection and pressure monitoring to verify the process in real time.
This combination allows automation to go beyond simply placing a component on the PCB. The goal is to keep the insertion process under control, detect conditions outside established parameters, and reduce variations that could affect assembly quality.
The equipment can also automatically adjust rail width for different PCB sizes and includes a board-thickness measurement system to compensate for insertion depth.
A Platform for Different Production Needs
The THIM3 offering encompasses different insertion configurations. The portfolio includes solutions for terminals, radial components, axial components, pins, and odd-form components, as well as different feeding systems that can be adapted to the characteristics of the materials.
For radial insertion, for example, the solutions can handle different types of components and pitch configurations, while the feeding systems are designed to support continuous operation and reduce downtime associated with material changes. The brochure also includes feeders for axial and radial components, as well as options for materials that require pre-bending before insertion.
This variety is particularly relevant for manufacturers working with multiple part numbers and different product configurations, where line flexibility can be just as important as production speed.
Vision and Data to Take Control of the Process
The evolution of THT insertion also involves turning the process into a source of production data.
THIM3 incorporates vision systems for identifying and positioning insertion points, as well as sensors for monitoring insertion depth and pressure. It also offers offline programming, data exchange, and integration with production systems in certain configurations.
In specialized solutions for IGBT, DBC, and power modules, the concept takes process control one step further. The brochure includes 2D and 3D vision systems to verify pin position and perpendicularity, insertion-force monitoring, and platforms with 360-degree rotation. These solutions are designed for applications in industries such as automotive, communications, aerospace, and new energy.
The proposal also includes MES connectivity through QR code recognition in certain applications, reinforcing the ability to integrate through-hole insertion into more connected production environments.
From the Individual Component to a More Complete THT Strategy
Insertion is only one part of the through-hole ecosystem. For this reason, Solucinde's 360° THT approach encompasses different stages of the process, from cutting and forming to insertion and selective or wave soldering.
Within this vision, THIM3 represents the automated insertion component, with technologies aimed at reducing dependence on manual operations and establishing more consistent processes.
The brochure also reports intelligent calibration and production data analysis functions, with claims of a potential 5% increase in insertion rate and a 5% reduction in production losses; these results should be understood within the specific conditions of each application.
The evolution of through-hole, in this sense, is not solely about increasing speed. It also involves making the process more predictable, improving traceability, and responding with greater flexibility to production needs.
THIM3 Will Be Featured at SMTA GDL 2026
These capabilities can be explored firsthand at SMTA Guadalajara Expo & Tech Forum 2026, an event that will bring together professionals from the electronics manufacturing industry on October 7 and 8 at Expo Guadalajara. Solucinde is included in the event's official exhibitor list.
For manufacturers looking to automate through-hole processes, the event represents an opportunity to explore the different THIM3 configurations, review their application possibilities, and understand how vision technologies, motion control, force monitoring, and programming can be integrated into a more efficient production strategy.
The invitation is open to those looking to take THT insertion from a necessary operation to an automated, precise, and connected process.
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